The glue is A, B two-component potting glue, component A is mainly composed of flexible epoxy resin, epoxy diluent, dibutyl ester, defoamer, black paste, filler; B component is mainly composed of 300 # Modified amine curing agent 948, accelerator composition; specific formulas are as follows:
A component:
Flexible epoxy resin 100,
Dibutyl ester 0 to 2 parts,
501 diluent 0.10 parts,
Defoamer 0 to 0.2 parts,
Black cream 0-5,
Filler 0.120 parts;
Group B: 100 parts of 300# modified amine curing agent
Accelerator 0 to 5 parts.
Potting adhesive preparation
a. Add flexible epoxy resin, dibutyl ester, epoxy diluent 501, defoamer, black paste, and filler in order to obtain a component A, a black viscous liquid. The viscosity at 25°C is 3 to 6 Pa·s.
b. Add 300# modified amine curing agent 948 and accelerant in the ingredient container and mix well to obtain the yellow transparent liquid component B. The viscosity at 25°C is 0.5 to 1 Pa·s.
c. The application of potting material: In the proportioner, according to the proportion of m(A):m(B)=4:1, the components A and B are weighed, and the mixture is evenly mixed, and the material can be poured or sealed after degassing. After mixing, the components A and B can be substantially cured at 25C and 24 h, and can be fully cured in 1 week.
Encapsulant Curing Performance Test With a flexible epoxy-based potting compound under the premise of volume resistance greater than 500 MΩ, according to the increase in the amount of reactive diluent, the flexibility of the cured material can be properly adjusted.
Source: 21st Century Fine Chemicals Network
Potting adhesive preparation